# TPCB\_LayersOfFill type

填充所属层

## Signature

```typescript
type TPCB_LayersOfFill = TPCB_LayersOfCopper | TPCB_LayersOfCustom | EPCB_LayerId.TOP_SILKSCREEN | EPCB_LayerId.TOP_SOLDER_MASK | EPCB_LayerId.TOP_PASTE_MASK | EPCB_LayerId.TOP_ASSEMBLY | EPCB_LayerId.BOTTOM_SILKSCREEN | EPCB_LayerId.BOTTOM_SOLDER_MASK | EPCB_LayerId.BOTTOM_PASTE_MASK | EPCB_LayerId.BOTTOM_ASSEMBLY | EPCB_LayerId.DOCUMENT | EPCB_LayerId.MECHANICAL | EPCB_LayerId.MULTI;
```
## References


[TPCB\_LayersOfCopper](./TPCB_LayersOfCopper.md)<!-- -->, [TPCB\_LayersOfCustom](./TPCB_LayersOfCustom.md)<!-- -->, [EPCB\_LayerId.TOP\_SILKSCREEN](../enums/EPCB_LayerId.md)<!-- -->, [EPCB\_LayerId.TOP\_SOLDER\_MASK](../enums/EPCB_LayerId.md)<!-- -->, [EPCB\_LayerId.TOP\_PASTE\_MASK](../enums/EPCB_LayerId.md)<!-- -->, [EPCB\_LayerId.TOP\_ASSEMBLY](../enums/EPCB_LayerId.md)<!-- -->, [EPCB\_LayerId.BOTTOM\_SILKSCREEN](../enums/EPCB_LayerId.md)<!-- -->, [EPCB\_LayerId.BOTTOM\_SOLDER\_MASK](../enums/EPCB_LayerId.md)<!-- -->, [EPCB\_LayerId.BOTTOM\_PASTE\_MASK](../enums/EPCB_LayerId.md)<!-- -->, [EPCB\_LayerId.BOTTOM\_ASSEMBLY](../enums/EPCB_LayerId.md)<!-- -->, [EPCB\_LayerId.DOCUMENT](../enums/EPCB_LayerId.md)<!-- -->, [EPCB\_LayerId.MECHANICAL](../enums/EPCB_LayerId.md)<!-- -->, [EPCB\_LayerId.MULTI](../enums/EPCB_LayerId.md)

## Remarks

填充所属层为 [EPCB\_LayerId.MULTI](../enums/EPCB_LayerId.md) 时代表挖槽区域